The Associated Research 3770 is a compact Hipot Tester with a built-in Insulation Resistance (I.R.)test. It has an enhanced graphic LCD and can be used as a bench-top instrument or remotely controlled via RS-232 or PLC Remote Control.It can also be interconnected to the HYAMP® III family of Ground Bond testers to form a complete test system that will perform AC/DC/IR Hipot and Ground Bond tests in a single DUT connection. It provides a simplified interface and the latest in technology & safety features. It is a perfect solution for entry level AC/DC/IR Hipot testing applications.
|Associated Research 39067||Associated Research 39067 DUT Enclosure (24" W x 19" D x 11.5" H) with safety interlock|
Associated Research 3770 Hypot III